Aerospace-Redmond is a leader in precision sensor technology, engineering and manufacturing. We provide a variety of Accelerometer and Thermal Switch products supporting tactical guidance, commercial aircraft navigation and down-hole energy exploration.The Adv Manufacturing Engineering Manager will manage a team of Manufacturing, Test Equipment and Process Engineers whose duties is the support of electro-mechanical based high performance product lines. Specific process knowledge desired for this role: design and implementation of automated test equipment (hardware and software), product assembly, brazing, tooling, epoxy bonding, chemical processes, soldering, small-scale manufacturing equipment and high-volume product manufacturing. Manufacturing uses clean-room technology. Key Responsibilities<ul><li> Employee Development</li><li> Reliability Engineering and Production Processes</li><li>Resource management in dynamic environment</li><li> Review quality output and coach team improvements</li><li>Collaborate with customers</li><li>Talent management</li><li>Project Planning and Execution Oversight</li><li>Provide technical support and Strategic Leadership to the ISC OEM Organization by driving customer service, health, safety and environmental HSE, quality, delivery and cost issues</li><li>Develop, support, and drive the global productivity goals for engineering savings, through: Repair Development, test system improvements and implementation of standardized processes (i.e. Workscoping)</li><li>Work as part of cross functional teams to identify opportunities to improve business performance relating to reliability, quality, process turn time, first pass yield, cost, productivity and warranty claims</li><li>Identify and implement aggressive cost reduction initiatives and identify external business opportunities relating to the business</li><li>Partner with our customers to identify and execute actions, which solve problems for our customers and drives future growth opportunities</li><li>Lead teams in addressing/supporting complex Root Cause Corrective Action investigations.</li></ul> U.S. PERSON REQUIREMENTS Due to compliance with U.S. export control laws and regulations, candidate must be a U.S. Person, which is defined as, a U.S. citizen, a U.S. permanent resident, or have protected status in the U.S. under asylum or refugee status. MUST HAVE<ul><li> 6+ Years experience in Engineering, Project Management or ISC</li></ul> WE VALUE<ul><li> Bachelor’s degree from an accredited institution in a technical discipline such as the sciences, technology, engineering, or mathematics</li><li> Six Sigma knowledge and/or demonstrated experience</li><li>Advanced knowledge of the field's standards and specifications</li><li>Computer literacy</li></ul> Compensation & Benefits:Incentive EligibleSalary Range: $140,000 - $176,000For benefits information, please visit https://benefits.honeywell.com/.Current employees may visit HR Direct. ADDITIONAL INFORMATION<ul><li>Job ID: HRD230712</li><li>Job Function: Integrated Supply Chain</li><li>Relocation Tier: Not Applicable</li><li>Security Clearance:</li><li>Aviation Authority (FAA for US):</li><li>Band: 04</li><li>Referral Bonus: 1,500.00</li><li>Requisition Type: Standard Requisition</li><li>US Citizenship: Due to US export control laws, must be a US citizen, permanent resident or have protected status.</li><li>FLSA Statement:</li><li>FLSA CODE: Exempt</li></ul>Honeywell is an equal opportunity employer. Qualified applicants will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectional or sexual orientation, gender identity or expression, disability, nationality, sex, religion, or veteran status.

Description Amazon Lab126 is an inventive research and development company that designs and engineers high-profile consumer electronics. Lab126 began in 2004 as a subsidiary of Amazon.com, Inc., originally creating the best-selling Kindle family of products. Since then, we have produced groundbreaking devices like Fire tablets, Fire TV, Amazon Echo and MFA products. What will you help us create? The Role: The Sr, Hardware Quality Engineering Manager (QEM) is responsible for ensuring that our products are designed for quality. As early as the concept phase of the product, the QEM will develop a risk assessment utilizing the NUD process (New, Unique, Different). This risk assessment will be comprehensive of lessons learned on previous products, along with technological, manufacturing and operational risks to the current design. The successful candidate will establish quality goals and monitor performance, investigate the full suite of failure analysis leading to root cause determination and subsequent closed loop corrective action. Conduct quality lessons learned and institutes remedies to prevent re-occurrence of quality issues and possess a high sense of urgency when managing critical issues. This position also needs to onsite support NPI builds and drive build issues to closure with RCCA/8D. In addition to the work done in the New Product Introduction (NPI) and Early Sustaining phase, the QEM of will drive continuous improvement in all aspects of the job, be able to deal with ambiguity, and influence at all levels of the company. In this role, you will: Understand the technology and functionality of consumer electronic products, and be able to assess the risk to a negative customer experience, so that it can be prevented during development Be an expert in advanced quality methods and protocol Guide cross-functional teams in Design for Quality initiatives Utilize your comprehensive knowledge of standards, related disciplines, company strategy and goals, to ensure a positive customer experience Deliver solutions to complex problems through in-depth data analysis and forensics by using methodical approaches, along with experience, innovation and judgment to make decisions that may be based on partial information Understand detailed implications of choices and recommendations; be able to communicate recommended solutions to the product development team, all the way up through the executive level of the company Align cross-functionally, influencing a broad spectrum of stakeholders to deliver on the quality policy Create standards around which others will operate and build consensus Ascertain specific quality related functional milestones during NPI Up to 30% of domestic and international travel to onsite factories is required. Export Control Requirement Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum. We are open to hiring candidates to work out of one of the following locations: Bellevue, WA, USA | Redmond, WA, USA Basic Qualifications - BSME/BSIE/BSEE/BSCE or related Engineering degree - - 10+ years of working experience in an engineering or quality role. - - 5+ years of practice experience with statistical tools, strong with quality program management. - - Familiar with NPI cycles and Product Development Process for consumer electronics industry. - - Good understanding of electronic assembly processes mostly on consumer electronics. - - Ability to deliver solutions to complex problems through in-depth data analysis and forensics, using methodical approach such as DMAIC - - Solid understanding and demonstrated success with practical applications of Lean / Six Sigma tools such as Failure Mode & Effects Analysis, Design of Experiments, Measurement System Analysis, Analysis of Variance, Hypothesis Testing, Value Stream Mapping, Pareto Charts, Gage Repeatability & Reproducibility, Cpk. - - Technical knowledge of conducting process audits and formulating plans to drive continual quality improvements within the factory operations. - - Must be self-motivated/self-directed, is able to manage multiple work streams simultaneously and flawlessly - - Excellent program management skill. Ability to work with and influence others. - - Excellent written and oral communication skills in English and Mandarin. - - Able to travel within China and South Asia Countries. Preferred Qualifications - Masters Degree with either MSME/MSIE/MSEE/BSCE - - Six Sigma Green/Black belt, ASQ CQE/M/A certifications are highly desired. - - Understanding of technology, at the system and commodity level as well as software and usability - - Design experience in different engineering aspect, such as EE, Mechanical, RF, IC, Display and etc. Amazon is committed to a diverse and inclusive workplace. Amazon is an equal opportunity employer and does not discriminate on the basis of race, national origin, gender, gender identity, sexual orientation, protected veteran status, disability, age, or other legally protected status. For individuals with disabilities who would like to request an accommodation, please visit https://www.amazon.jobs/en/disability/us. Our compensation reflects the cost of labor across several US geographic markets. The base pay for this position ranges from $128,600/year in our lowest geographic market up to $213,600/year in our highest geographic market. Pay is based on a number of factors including market location and may vary depending on job-related knowledge, skills, and experience. Amazon is a total compensation company. Dependent on the position offered, equity, sign-on payments, and other forms of compensation may be provided as part of a total compensation package, in addition to a full range of medical, financial, and/or other benefits. For more information, please visit https://www.aboutamazon.com/workplace/employee-benefits. This position will remain posted until filled. Applicants should apply via our internal or external career site.

Overview
The Microsoft Silicon team is transforming the ways people communicate, create, and collaborate through the devices and components we develop. We’re a growing team of engineers on a mission to develop revolutionary designs and provide leading edge silicon device solutions to power Microsoft computer and datacenter requirements. Microsoft systems including Azure, Xbox and HoloLens incorporate our internally developed silicon components. Our team is creative and resourceful; we value growth and learning. We want to amplify your abilities so you can do your best work. Join us, and together we’ll turn groundbreaking hardware designs into reality!
We are seeking a Principal Mechanical Thermal Engineer Analyst to work in Microsoft Azure hardware engineering team!
Microsoft’s mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.
Responsibilities
Responsibilities:
The Principal Mechanical Thermal Engineer Analyst will be responsible for developing and performing advanced mechanical, thermal, finite element analysis for High Performance Computing (HPC) silicon designs and Microsoft systems including Azure, Xbox and HoloLens. In this role, you will be responsible for both mechanical and thermal modelling of new packaging technology, design and development of test vehicles, and development of mechanical/thermal solutions for test, and power distribution/thermal modelling of custom silicon devices.
Specific responsibilities to include:
Develop material property database to support all the finite element analysis on substrate, silicon, interconnect, socket, etc. Assess and characterize reliability of Integrated Circuits (IC) packages. Develop and deliver FMEA (Failure Mode and Efects Analysis) for various technology options. Define, design and develop test vehicles to validate Silicon, Package, System performance. Drive mechanical and thermal analysis for Test hardware. Design and develop package and assembly drawings to support the manufcaturring. Drive future package architecture solutions for chiplet architetcutre with advanced packaging , silicon nodes and system designs. Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers. Drives the execution of architecture solutions across product lines or multiple product groups and across teams that account for design trends and future concepts by leveraging cross- functional expertise, industry best practices, and lessons learned from teams working across multiple product lines. Drives engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs. Embody our Culture (https://www.microsoft.com/en-us/about/corporate-values) and Values (https://careers.microsoft.com/us/en/culture)
Qualifications
Required Qualifications:
9+ years of related technical engineering experience
o OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience or internship experience.
o OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience or internship experience.
o OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience.
7+ years of experience in the field of Mechanical Finite Element Analysis (FEA), Silicon-Package Platform co-design with knowledge of product development.
7+ years of experience in the field of advance packaging (2D, 2.5D, 3D, Land Grid Array (LGA), Ball Grid Array (BGA), Optical) modeling, design, development and validation.
Other Requirements:
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role.
These requirements include, but are not limited to the following specialized security screenings:
Microsoft Cloud Background Check:
This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Preferred Qualifications
MSEE degree with 10 years’ experience in silicon packaging products development Experience with Thermal Mechanical system design for HPC products Foundation in advanced packaging technolgoies as it relates to mechanics Experience with Foundry Silicon technologies and System boundary conditions Silicon Engineering IC5 - The typical base pay range for this role across the U.S. is USD $133,600 - $256,800 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $173,200 - $282,200 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay
Microsoft will accept applications for the role until May 10, 2024.
Microsoft is an equal opportunity employer. Consistent with applicable law, all qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations (https://careers.microsoft.com/v2/global/en/accessibility.html) . #J-18808-Ljbffr

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Engineering Manager Jobs in Redmond, WA

Senior Security Engineering ManagerJuly 17, 2024

Advanced Manufacturing Engineering ManagerJuly 16, 2024

Principal Engineering ManagerJuly 6, 2024

Critical Facilities Engineering ManagerJuly 1, 2024

Group Engineering Manager Microsoft WeatherJuly 1, 2024

Sr Quality Engineering Manager Amazon Devices Quality LeanJune 30, 2024

Principal Group Engineering ManagerJune 28, 2024

Thermal Engineering ManagerJune 28, 2024